Modular elements employing latches with flexure bearings

ABSTRACT

Modular elements employing latches with flexure bearings are disclosed. A modular element may include a chassis body supporting electronic components. The body is in communication with a latch and a control member of the modular element. The modular element is removable from or secured to an enclosure using the latch. The latch may engage the enclosure and may remain engaged by being secured by interfacing with a catch of an arm of the control member. By connecting the arm to the control body with a flexure bearing, the flexure bearing may urge the catch into a detent of the latch to secure the latch and keep the modular element secured to the enclosure. The latch may be disengaged from the control member by removing the catch from the detent. In this manner, the modular element is efficiently secured and removed from the enclosure.

BACKGROUND

The present disclosure relates to enclosure systems having removableequipment elements, and in particular, to electronic componentssupported by elements which are removable from enclosures.

TECHNICAL BACKGROUND

Benefits of enclosures include an establishment of an internal volumethat provides protection and organization of the contents therein. Insome applications, enclosures form a structural framework and protectionof internal volumes, for example, from electromagnetic radiation,humidity, moisture, and heat. Items to be disposed within the internalvolumes of enclosures may be supported as part of modular elements whichare secured to the structural framework of the enclosure during use. Thestructural framework also precisely positions and holds firmly themodular elements, so that the internal volume may be precisely populatedto optimize cooling flow, resist vibration, maximize storage capacity,and/or provide convenient interfaces for modular elements to beefficiently replaced (“swapped out”) by personnel without damage whenmaintenance and/or upgrades are required.

As technology improves, demands to reduce cost while simultaneouslyincreasing performance continues, and there is an increasing need topopulate enclosures with higher densities of components withinenclosures to reduce the footprints of data centers and improve thespeed of electronic components by decreasing the distances therebetween.With the resultantly highly-populated enclosures it is becoming morechallenging to identify available volume within enclosures to routesupply power cables and cooling air for components. Structuralcomponents of the enclosure and latching systems to secure the modularunits to the enclosure are physically occupying spatial volume thatcould be occupied for additional electronic components or pathways forcooling air, communication cables, or power cords to support additionalcomponents in the enclosure. New approaches are needed to reliablysecure modular units within enclosures while occupying minimum volume,and enabling efficient upgrades and maintenance.

SUMMARY

Embodiments disclosed herein include modular elements employing latcheswith flexure bearings. A modular element may include a chassis bodysupporting electronic components. The body is in communication with alatch and a control body of a control member of the modular element. Themodular element is removable from or secured to an enclosure using thelatch. The latch may engage the enclosure and may remain engaged withthe enclosure by being temporarily secured by interfacing with a controlcatch of a control arm of the control member. By connecting the controlarm to the control body with a living hinge, the living hinge may urgethe control catch into a detent of the latch to secure the latch andkeep the modular element secured to the enclosure. The latch may bedisengaged from the control member by removing the control catch fromthe detent. In this manner, the modular element is efficiently securedand removed from the enclosure with minimum obstruction to airflowprovided to the electronic components.

According to one embodiment of the present invention, a modular elementis disclosed. The modular element is removable from an enclosure duringan unlocked mode and secured in enclosure during a locked mode. Themodular element includes a chassis body supporting electroniccomponents. The modular element further includes at least one latch inpivotable communication with the chassis body and configured to beengaged with the enclosure during the locked mode. The modular elementalso includes a control member including a control body in slidablecommunication with the chassis body. The control member is in slidablecommunication between a first position during the locked mode and asecond position during the unlocked mode. The control member alsoincludes at least one control arm connected to the control body by atleast one living hinge of the control member. Upon movement of thecontrol body to the first position, the at least one living hingesecures the at least one latch by urging a control catch of the at leastone control arm within a detent of the at least one latch. In thismanner, the modular element may efficiently be secured and removed fromthe enclosure to enable hot swapping of electronic components formaintenance or upgrades.

According to one embodiment of the present invention, a method forsecuring and removing a modular element within an enclosure isdisclosed. The method includes disposing at least a portion of a chassisbody of the modular element within the enclosure. The chassis bodysupporting electronic components. The modular element includes at leastone latch in pivoting communication with the chassis body and a controlbody of a control member in slidable communication with the chassisbody. The method further includes securing the chassis body within theenclosure by moving the latch with respect to the chassis body to engagethe at last one latch with the enclosure. The method also includespivoting the at least one latch with respect to the chassis body byapplying an installation force to the at least one latch to dispose adetent of the at least one latch adjacent to a control catch of acontrol arm of the control member. The method also includes securing theat least one latch with respect to the chassis body by urging thecontrol catch into the detent with a living hinge of the control member.The living hinge connects the control arm to the control body. In thismanner, the modular element may efficiently be secured and removed fromthe enclosure with a reduced spatial volume enabling additionalelectronic components to populate the enclosure.

According to one embodiment of the present invention, an electronicdevice is disclosed. The electronic device includes an enclosure. Theelectronic device also includes a modular element removable from theenclosure. The modular element includes at least one latch in pivotablecommunication with the chassis body and configured to be engaged withthe enclosure during the locked mode. The modular element furtherincludes a control member including a control body in slidablecommunication with the chassis body between a first position during thelocked mode and a second position during the unlocked mode. The controlmember also includes at least one control arm connected to the controlbody by at least one living hinge of the control member. Upon movementof the control body to the first position, the at least one living hingesecures the at least one latch by urging a control catch of the at leastone control arm within a detent of the at least one latch. The controlmember includes at least one push member extending from the control armand in communication with a respective protrusion extending from thechassis body. Upon application of a disengagement force to the controlmember, the control body of the control member is configured to move tothe second position and the respective protrusion resists the movementof the push member by flexing the living hinge and disengaging thecontrol catch of the at least one control arm from the detent. In thismanner, a high flow of airflow can be supplied to the electroniccomponents in the enclosure with the small volume occupied by thecontrol member and latch.

Additional features and advantages will be set forth in the detaileddescription which follows, and in part will be readily apparent to thoseskilled in the art from that description or recognized by practicing theembodiments as described herein, including the detailed description thatfollows, the claims, as well as the appended drawings.

It is to be understood that both the foregoing general description andthe following detailed description present embodiments, and are intendedto provide an overview or framework for understanding the nature andcharacter of the disclosure. The accompanying drawings are included toprovide a further understanding, and are incorporated into andconstitute a part of this specification. The drawings illustrate variousembodiments, and together with the description serve to explain theprinciples and operation of the concepts disclosed.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentdisclosure can be understood in detail, a more particular description ofthe disclosure, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlyexemplary embodiments and are therefore not to be considered limiting ofits scope, may admit to other equally effective embodiments.

FIG. 1 is a top perspective exploded view of an exemplary electronicdevice including an enclosure and removable modular elements, whereinthe modular elements each include a chassis body supporting electroniccomponents, at least one latch, and a control member;

FIGS. 2A through 2G are a bottom view, right side view, left side view,front view, rear view, bottom perspective view, and bottom perspectiveexploded view of an exemplary one of the modular elements of FIG. 1;

FIG. 3 is a flowchart of an exemplary method for securing the modularelement of FIG. 2A within the enclosure of FIG. 1 before removing themodular element;

FIG. 4A is a bottom view of the modular element of FIG. 2A being securedto receptors of the enclosure and the at least one latch of the modularelement being secured in the lock mode by the control member;

FIG. 4B is a bottom view of the modular element of FIG. 4A illustratinga disengagement force being applied to the control member of the modularelement to mobilize the at least one latch; and

FIG. 4C is a bottom view of the modular element of FIG. 4B illustratingremoving the modular element from the enclosure by applying a removalforce to the at least one latch.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. It is contemplated that elements and features of oneembodiment may be beneficially incorporated in other embodiments withoutfurther recitation.

DETAILED DESCRIPTION

Reference will now be made in detail to the embodiments, examples ofwhich are illustrated in the accompanying drawings, in which some, butnot all embodiments are shown. Indeed, the concepts may be embodied inmany different forms and should not be construed as limiting herein.Whenever possible, like reference numbers will be used to refer to likecomponents or parts.

Embodiments disclosed herein include modular elements employing latchesand control members with flexure bearings securable within enclosures. Amodular element may include a chassis body supporting electroniccomponents. The body is in communication with a latch and a control bodyof a control member of the modular element. The modular element isremovable from or secured to an enclosure using the latch. The latch mayengage the enclosure and may remain engaged with the enclosure by beingsecured by interfacing with a control catch of a control arm of thecontrol member. The control arm is flexibly connected to the controlbody by the flexure bearing which, in one embodiment, may be a livinghinge. The living hinge has sufficient rigidity so as to be self-biasedtoward a neutral position, but may be urged away from the neutralposition by application of an appropriate disengagement force to thecontrol member. In the neutral position (or while being biased towardthe neutral position), the living hinge urges the control catch into adetent of the latch to secure the latch and keep the modular elementsecured to the enclosure. Applying the disengagement force to thecontrol member overcomes the self-bias of the living hinge and causesthe control catch to be removed from the detent, thereby disengaging thelatch. In this manner, the modular element is efficiently secured andremoved from the enclosure with minimum obstruction to airflow to theelectronic components.

FIG. 1 is a top perspective exploded view of an exemplary electronicdevice 100 including an enclosure 102 and removable modular elements104(1)-104(N) which may be individually installed and later removed fromthe enclosure 102. Each of the removable modular elements 104(1)-104(N)includes a chassis body 106 supporting electronic components 108, atleast one latch 110A, 110B, and control member 112. As discussed in moredetail below, the latches 110A, 110B may engage at least one receptor114A, 114B of the enclosure 102 to secure the respective one of themodular element 104(1)-104(N) within the enclosure 102. The controlmember 112 includes a control body in communication with the chassisbody and a control arm connected to the control body by at least oneliving hinge of the control member 112 (as discussed later relative toFIG. 2B) to secure the latches 110A, 110B and maintain the respectivemodular element 104(1) secured to the enclosure 102. A disengagementforce F2 (FIG. 4B) may be applied to the control member 112 to enablethe latches 110A, 110B to disengage from the enclosure 102. In thismanner, each of the modular elements 104(1)-104(N) may be removablysecured to the enclosure 102.

The electronic components 108 may be supported to respective ones of thechassis bodies 106 of the modular elements 104(1)-104(N). The electroniccomponents 108 may, for example, include semiconductor-based processorand/or semiconductor-based storage components. When the modular elements104(1)-104(N) are secured in the enclosure 102, the electroniccomponents 108 of the modular elements 104(1)-14(N) may also be coupled(not shown) at the back 119A of the modular elements 104(1)-104(N) toconnector slots 116 of a midplane 118. The connector slots 116 mayinclude power and a signal interfaces for the electronic components 108to function and exchange information with a second chassis 120. Thesecond chassis 120 may contain various hot plug-able components forcooling, power, control, and switching. The second chassis may slide toand latch onto the chassis 102. The second chassis 120 may contain hotplug-able blowers 122A, 122B include backward-curved impeller blowersand provide redundant cooling to various components of the electronicdevice 100. Airflow may be directed from the front to the rear of thesecond chassis 120. Each of the modular elements 104(1)-104(N) mayincludes a front grille to admit air, and low-profile vapor chamberbased heat sinks to cool the electronic components 108. In one example,the total airflow through the electronic device 100 s may beapproximately 300 CFM at a 0.7 inch H2O static pressure drop.

With continued reference to FIG. 1, the electronic device 100 may alsoinclude power modules 124A-124D, management modules 126A, 126B, andswitch modules 128A-128D. The power modules 124A-124D provide operatingvoltages for the electronic components 108. The management modules 126A,126B may provide basic management functions, for example, controlling,monitoring, alerting, restarting, and diagnostics. The managementmodules 126A, 126B may have separate communications links (e.g.Ethernet) to the switch modules 128A-128D providing communications withthe electronic components 108. In addition, communication cable groups130A, 130B may be connected at a front 119B of the modular elements104(1)-104(N). In this manner, power, communication, and environmentalcooling may be provided to the electronic components 108 of the modularelements 104(1)-104(N).

FIGS. 2A through 2G are a bottom view, right side view, left side view,front view, rear view, bottom perspective view, and bottom perspectiveexploded view of the module element 104(1) of the modular elements104(1)-104(N) of FIG. 1. In this regard, the module element 104(1)includes the chassis body 106, the at least one latch 110A, 110B, andthe control member 112. Each of these will now be discussed sequentiallyand in reference to the FIGS. 2A through 2G.

The chassis body 106 supports the electronic components 108 and servesas the structural foundation for each of the modular elements140(1)-140(N). The chassis body 106 includes a first side 202A and asecond side 202B opposite the first side 202A. The electronic components108 may be attached to the first side 202A, second side 202B and/orwithin the chassis body 106. The first side 202A and the second side202B extend from the front 119B to the back 119A of the modular element104(1) and from a left side 204A of the modular element 104(1) to aright side 204B of the modular element 104(1). The chassis body 106 maycomprise a strong material, for example, plastic, metal, or compositesto prevent bending which may cause unwanted contact between adjacentmodular elements 104(2)-104(N) and/or undesirable transient changes incooling air passageways along the first side 202A and the second side202B of the modular element 104(1). In this manner, the left side 204Aand the right side 204B of the chassis body 106 are configured to beadjacent to or interface with the enclosure 102 to maximize the size ofthe modular element 104(1) for a given size of enclosure 102.

The chassis body 106 may provide electrical interconnection and maycomprise a circuit board or other electronic interconnecting structureto provide power and intercommunication with the electronic components108 supported thereon. The electronic devices 108 may be supported fromone or more of the first side 202A and the second side 202B. In somecases the electronic devices 108 may be supported on an opposite side ofthe chassis body 106 from where the control member 112 and the latches110A, 110B communicate with the chassis body 106. In this manner,movement of the control member 112 and the latches 110A, 110B may beunimpeded by a presence of the electronic devices 108 on the oppositeside of the chassis body 106.

With continued reference to FIGS. 2A through 2G, the latches 110A, 110Bremovably secure the chassis body 106 to the enclosure 102. The latches110A, 110B respectively include catch portions 212A, 212B which areconfigured to be secured to the enclosure 102 by interfacing with thereceptors 114A, 114B of the enclosure 102. The receptors 114A, 114B ofthe enclosure 102 may comprise holes or cavities within the enclosure102 where when the catch portions 212A, 212B may be received. Oncereceived, the receptors 114A, 114B prevent the latch 110A, 110B and thechassis body 106 attached to the latches 110A, 110B from being removedfrom the enclosure 102 until the catch portions 212A, 212B disengagesfrom the receptors 114A, 114B.

The latches 110A, 110B are in pivotable communication with the chassisbody 106. The pivotable communication may be created by spindles 206A,206B which extend from the chassis body 106 and interface with innersurfaces 208A, 208B of the latches 110A, 110B. The inner surfaces 208A,208B form respective holes 210A, 210B of the latches 110A, 110B. Thelatches 110A, 110B may pivot relative to the chassis body 106 as thespindles 206A, 206B interface with the inner surfaces 208A, 208B. Themodular element 104(1) is moved along a direction X (see FIG. 1) to bedisposed in the enclosure 102 and in a suitable position to be securedwithin the enclosure 102. In order to secure the chassis body 106 withinthe enclosure 102, the at least one latch 110, 110B may pivot relativeto the chassis body 106, so that the catch portion 212A, 212B of the atleast one latch 110A, 110B moves at least partially parallel in theY-direction and into the receptors 114A, 114B of the enclosure 102. Thepivoting of the latches 110A, 110B may occur by applying an installationforce F1 to each of the latches 110A, 110B as depicted in FIG. 2A.

While the catch portion 212A, 212B of the latches 110A, 110B remaindisposed within the receptors 114A, 114B of the enclosure 102, thereceptors 114A, 114B restrict movement of the catch portions 212A, 212Bof the latches 110A, 110B in the X-direction. As long as the latches110A, 110B remain stationary relative to the chassis body 106, the catchportions 212A, 212B of the latches 110A, 110B remain engaged in thereceptors 114A, 114B of the enclosure 102 and the modular element 104(1)will be prevented from movement in the X-direction out of the opening132 (FIG. 1) of the enclosure 102. The enclosure 102 may preventmovement of the chassis body 106 parallel to the Y-direction. In thismanner, the latches 110A, 110B removably secure the modular element104(1) within the enclosure 102 and place the modular element 104(1) ina locked mode.

The control member 112 secures the latches 110A, 110B engaged with thereceptors 114A, 114B of the enclosure 102 while in the locked mode. Thecontrol member 112 includes a control body 214, at least one control arm216A, 216B, at least one living hinge 218A, 218B, at least one pushmember 220A, 220B, and at least one control catch 221A, 221B. Thecontrol body 214 is in slidable communication with the chassis body 106and may include a linear slide 222 to enable movement of the controlbody 214 between a first position 223A and a second position 223B. Inthis regard, the control member 112 is in the first position 223A duringa locked mode when the modular element 104(1) is secured to theenclosure 102 and in the second position 223B during the unlocked modewhen the latches 110A, 110B are mobilized and able to disengage from theenclosure 102. The control body 214 may receive the disengagement forceF2 (as discussed later in FIG. 4B) to enable the user to mobilize thelatches 110A, 110B. The linear slide 222 may facilitate movement of thecontrol body 214 to be parallel to a direction, for example theX-direction depicted in FIG. 1, in which the modular element 104 isurged into and removed from the enclosure 102. In this manner, thecontrol body 214 may be easily accessible to the user at the front 119B(FIG. 1) of the modular element 104(1), and also the movement of thecontrol body 214 is symmetric to the latches 110A, 110B enabling similaroperation of the latches 110A, 110B on the left 204A and the right side204B (FIG. 2A) of the modular element 104(1) to more equally distributethe loads on the enclosure 102 to reduce maintenance.

The control arms 216A, 216B are connected to the control body 214 by theliving hinges 218A, 218B. The living hinges 218A, 218B enable thecontrol arms 216A, 216B to move, for example pivot, relative to thecontrol body 214. The living hinges 218A, 218B may comprise a strongresilient material, for example, plastic, metal or aluminum. The controlarms 216A, 216B include the control catches 221A, 221B, for example inthe shape of a protruding lip, which are configured to be receivedwithin detents 224A, 224B of the latches 110A, 110B. The living hinges218A, 218B may have sufficient rigidity so as to be self-biased toward aneutral position and when moving to the neutral position may urge thecontrol catches 221A, 221B into the detents 224A, 224B when the controlcatches 221A, 221B are disposed adjacent to the detents 224A, 224B. Thelevers 110A, 110B are secured and unable to disengage from the enclosure102 when the control catches 221A, 221B are received in the detents224A, 224B of the latches 110A, 110B. In this manner, the modularelement 104(1) may be secured to the enclosure 102 in a locked mode asthe latches 110A, 110B remain secured with the catch portions 212A, 212Bengaged in the receptors 114A, 114B of the enclosure 102 and the modularelement 104(1) prevented from movement in the X-direction out of theopening 132 of the enclosure 102.

With continued reference to FIGS. 2A through 2G, several components ofthe modular element 104(1) work together to enable the unlocked modewhere the modular element 104(1) may be removed from the enclosure 102.In this regard, the living hinges 218A, 218B operate in cooperation withthe push members 220A, 220B, and protrusions 226A, 226B of the chassisbody 106 to disengage the control catches 221A, 221B of the control arms216A, 216B from the detents 224A, 224B. In one example, disengagementforce F2 may be applied to the control body 214 to move the control body214 along the linear slide 222. The protrusions 226A, 226B resist themovement of the push members 220A, 220B by flexing the living hinges218A, 218B in a direction away from the neutral position of the livinghinges 218A, 218B to remove or disengage the control catches 221A, 221Bfrom the detents 224A, 224B of the latches 110A, 110B. In this manner,the latches 110A, 110B become free to move about the latch spindles206A, 206B and disengage the catch portions 212A, 212B from theenclosure 102 to enable the modular element 104(1) to be removed fromthe enclosure 102. The modular elements 104(2)-104(N) may operate in asimilar manner as modular element 104(1).

It is noted that the control body 214, the control arms 216A, 216B, thepush members 220A, 220B, and the latches 110A, 110B of the modularelement 104(1) may be disposed and/or move within a geometric plane P1(see FIGS. 2D and 2E). This co-planar arrangement and movement hasseveral benefits. Cooling airflow provided to the electronic components108 may be increased as the control body 214, the control arms 216A,216B, the push members 220A, 220B, and the latches 110A, 110B of themodular element 104(1) may be disposed adjacent to the chassis body 106.This adjacent arrangement provides minimal obstruction to the airflow(not shown) which may be directed parallel to the first side 202A and/ora second side 202B of the chassis body 106. Also, the control body 214,the control arms 216A, 216B, the push members 220A, 220B, and thelatches 110A, 110B may be made lighter and more compact to accommodateco-planar movements and forces within the geometric plane P1 and avoidmore complex and/or unnecessary structure. The complex structure whichhas been avoided would be needed to accommodate movements and/or forcesoutside of the geometric plane P1. In this manner, the modular element104(1) may more efficiently provide cooling to the electrical components108 and reduce costs.

FIG. 3 is a flowchart of an exemplary method 300 for securing themodular element 104(1) of FIG. 2A within the enclosure 102 of FIG. 1 andremoving the modular element 104(1) from the enclosure 102. The method300 is now discussed using the terminology discussed above in relationto the operations 302A-302H as depicted in FIG. 3. In this regard, themethod 300 includes disposing at least a portion of a chassis body 106of the modular element 104(1) within the enclosure 102, wherein thechassis body 106 supports electronic components 108 (operation 302A ofFIG. 3). The modular element 104(1) includes the latches 110A, 110B inpivoting communication with the chassis body 106 and the control body214 of the control member 112 in slidable communication with the chassisbody 106. The method 300 also includes securing the chassis body 106within the enclosure 102 by moving the latches 110A, 110B with respectto the chassis body 106 and engaging the catch portions 212A, 212B ofthe latches 110A, 110B with the enclosure 102 (operation 302B of FIG.3).

As shown in FIG. 4A, the method 300 also includes pivoting the latches110A, 110B with respect to the chassis body 106 by applying theinstallation force F1 to the latches 110A, 110B to dispose the detents224A, 224B of the latches 110A, 110B adjacent to the control catches221A, 221B of the control arms 216A, 216B of the control member 112(operation 302C of FIG. 3). The method 300 also includes securing thelatches 110A, 110B with respect to the chassis body 106 by urging thecontrol catches 221A, 221B into the detents 224A, 224B with the livinghinges 218A, 218B of the control member 112 (operation 302D of FIG. 3).The living hinges 218A, 218B connect the control arms 216A, 216B to thecontrol body 214. In this manner, the modular element 104(1) may besecured in a locked mode.

The method 300 may also include operating the electronic componentssupported on the chassis body 106 (operation 302E of FIG. 3). One ormore of the modular elements 104(1)-104(N) may be removed whenmaintenance or upgrades are required. When removal is initiated themodular elements 104(1)-104(N) are to be unsecured from the enclosure102 to facilitate removal in the unlocked mode. In this regard, as shownin FIG. 4B, the method 300 may include mobilizing the latches 110A, 110Bby applying the disengagement force F2 to the control body 214 of thecontrol member 112 (operation 302F of FIG. 3). The disengagement forceF2 moves the control body 214 along the linear slide 222. Theprotrusions 226A, 226B resist the movement of the push members 220A,220B by flexing the living hinges 218A, 218B in a direction to remove ordisengage the control catches 221A, 221B from the detents 224A, 224B ofthe latches 110A, 110B. In this manner, the latches 110A, 110B becomefree to move about the latch spindles 206A, 206B and disengage the catchportions 212A, 212B from the enclosure 102 to enable the modular element104(1) to be removed from the enclosure 102.

The method 300 may also include unsecuring the chassis body 106 from theenclosure 102 by moving the latches 110A, 110B with respect to thechassis body 106 and disengaging the catch portions 212A, 212B of thelatches 110A, 110B from the enclosure 102 (operation 302G of FIG. 3).

As depicted in FIG. 4C, the method may also include removing the modularelement 104(1) from the enclosure 102 with an application of a removalforce F3 to the latches 110A, 110B (operation 302H of FIG. 3). Themodular element 104(1) may in some cases slide along a rail (not shown)of the enclosure 102 as the removal force F3 is applied. In this manner,the modular element 104(1) may be removed from the enclosure 102.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

In the following, reference is made to embodiments presented in thisdisclosure. However, the scope of the present disclosure is not limitedto specific described embodiments. Instead, any combination of thefollowing features and elements, whether related to differentembodiments or not, is contemplated to implement and practicecontemplated embodiments. Furthermore, although embodiments disclosedherein may achieve advantages over other possible solutions or over theprior art, whether or not a particular advantage is achieved by a givenembodiment is not limiting of the scope of the present disclosure. Thus,the following aspects, features, embodiments and advantages are merelyillustrative and are not considered elements or limitations of theappended claims except where explicitly recited in a claim(s). Likewise,reference to “the invention” shall not be construed as a generalizationof any inventive subject matter disclosed herein and shall not beconsidered to be an element or limitation of the appended claims exceptwhere explicitly recited in a claim(s).

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems), and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer readable program instructions.

Many modifications and other embodiments not set forth herein will cometo mind to one skilled in the art to which the embodiments pertainhaving the benefit of the teachings presented in the foregoingdescriptions and the associated drawings. Therefore, it is to beunderstood that the description and claims are not to be limited to thespecific embodiments disclosed and that modifications and otherembodiments are intended to be included within the scope of the appendedclaims. It is intended that the embodiments cover the modifications andvariations of the embodiments provided they come within the scope of theappended claims and their equivalents. Although specific terms areemployed herein, they are used in a generic and descriptive sense onlyand not for purposes of limitation.

While the foregoing is directed to embodiments of the present invention,other and further embodiments of the invention may be devised withoutdeparting from the basic scope thereof, and the scope thereof isdetermined by the claims that follow.

What is claimed is:
 1. A modular element removable from an enclosureduring an unlocked mode and secured in the enclosure during a lockedmode, the modular element comprises: a chassis body supportingelectronic components; at least one latch in pivotable communicationwith the chassis body and configured to be engaged with the enclosureduring the locked mode; and a control member including a control body inslidable communication with the chassis body between a first positionduring the locked mode and a second position during the unlocked mode,the control member also includes: at least one control arm connected tothe control body by at least one living hinge of the control member; andat least one push member extending from the control arm and incommunication with a respective protrusion extending from the chassisbody, wherein the at least one control arm extends from the living hingein a first direction, and wherein the at least one push member extendsfrom the control arm in a second direction away from the control body,wherein the first direction is different from the second direction;wherein upon movement of the control body to the first position, the atleast one living hinge secures the at least one latch by urging acontrol catch of the at least one control arm within a detent of the atleast one latch, and wherein upon application of a disengagement forceto the control member, the control body of the control member is urgedto the second position and the respective protrusion resists themovement of the at least one push member by flexing the living hinge anddisengaging the control catch of the at least one control arm from thedetent.
 2. The modular element of claim 1, wherein the control body, theat least one control arm, and the at least one push member, and the atleast one latch move within a geometric plane.
 3. The modular element ofclaim 1, wherein the living hinge comprises plastic, metal or aluminum.4. The modular element of claim 1, wherein when in the unlocked mode theat least one latch is configured to receive an installation force torotate the at least one latch relative to the chassis body and place thedetent of the at least one latch proximate to the control catch of theat least one control arm.
 5. The modular element of claim 1, wherein theat least one latch communicates with the chassis body through at leastone spindle configured to provide relative rotational motiontherebetween.
 6. The modular element of claim 5, wherein the spindlescomprise cylindrically-shaped protrusions extending from the chassisbody and interfacing with circular-shaped holes of the at least onelatch.
 7. The modular element of claim 1, wherein the modular elementincludes a linear slide to connect the control body to the chassis bodyand enable the control body to move linearly between the first positionand the second position.
 8. The modular element of claim 1, wherein theelectronic components include at least one of: semiconductor-basedinformation storage devices, semiconductor-based processor devices,electrical connectors, and fiber optic connectors.
 9. The modularelement of claim 1, wherein the chassis body includes a first side and asecond side opposite of the first side, wherein the electroniccomponents are disposed at the first side and the at least one latch,and the control member are disposed on the second side.
 10. The modularelement of claim 1, wherein the at least one living hinge includes aneutral position which is disposed to urge the control catch of the atleast one control arm within the detent when the control catch isadjacent to the detent.
 11. The modular element of claim 1, wherein theat least one living hinge includes a neutral position and is urged awayfrom the neutral position and disengages the control catch from thedetent by the application of the disengagement force to the controlmember.
 12. An electronic device, comprising: an enclosure; a modularelement removable from the enclosure, wherein the modular elementincludes: a chassis body supporting electronic components; at least onelatch in pivotable communication with the chassis body and configured tobe engaged with the enclosure during the locked mode; and a controlmember including a control body in slidable communication with thechassis body between a first position during the locked mode and asecond position during the unlocked mode, the control member alsoincludes at least one control arm connected to the control body by atleast one living hinge of the control member, wherein upon movement ofthe control body to the first position, the at least one living hingesecures the at least one latch by urging a control catch of the at leastone control arm within a detent of the at least one latch, wherein thecontrol member includes at least one push member extending from thecontrol arm and in communication with a respective protrusion extendingfrom the chassis body, wherein the at least one control arm extends fromthe living hinge in a first direction, and wherein the at least one pushmember extends from the control arm in a second direction away from thecontrol body, wherein the first direction is different from the seconddirection, and wherein upon application of a disengagement force to thecontrol member, the control body of the control member is urged to thesecond position and the respective protrusion resists the movement ofthe push member by flexing the living hinge and disengaging the controlcatch of the at least one control arm from the detent.
 13. Theelectronic device of claim 12, wherein the control body, the at leastone control arm, and the at least one push member, and the at least onelatch move within a geometric plane.
 14. The electronic device of claim12, wherein the living hinge comprises plastic, metal or aluminum. 15.The electronic device of claim 12, wherein when in the unlocked mode theat least one latch is configured to receive an installation force torotate the at least one latch relative to the chassis body and place thedetent of the at least one latch proximate to the control catch of theat least one control arm.
 16. The electronic device of claim 12, whereinthe modular element includes a linear slide to connect the control bodyto the chassis body and enable the control body to move linearly betweenthe first position and the second position.
 17. The electronic device ofclaim 12, wherein the at least one latch communicates with the chassisbody through at least one spindle configured to provide relativerotational motion therebetween.
 18. The electronic device of claim 17,wherein the spindles comprise cylindrically-shaped protrusions extendingfrom the chassis body and interfacing with circular-shaped holes of theat least one latch.